Hydrogen peroxide is not pre-added, and the product has high stability. Adjusting the proportion of hydrogen peroxide can change the etching rate. Low operating temperature; high metal selectivity. Contains special surfactants and has excellent wettability.

CL-6690 is a special design for dry film (photoresist) stripping agent. Except for effective accelerated stripping, it can clean the metal surface and will not attack the metal (tin, aluminum, copper) under high temperature operation. The agent has a long life time and is a powerful multifunctional stripping agent.

This series of developers are designed for the development of dry film and solder masking. During the preparation process, the soda ash is purified. At the same time, its special additives can speed up the development speed, prevent the generation of scale, and extend the life time of the bath up to 3 to 5 times.

TWA-280 is a new type of tank rising agent specially designed for cleaning the developing and stripping tank. It is composed of a special surfactant and emulsifier that can quickly clear the bottom of the tank. Regular cleaning can keep the tank clean, improve the development and stripping quality.

CT-888 is a special formula of SPS promoting additive, which can effectively increase the utilization rate of SPS, reduce the amount of SPS used, and does not affect the Ra and RZ.

i-etch108 is a side corrosion inhibitor stabilizer for PCB etching (H2SO4/H2O2 system).

CL-6680 is a stripping agent specially designed for BGA removal. In addition to effectively speeding up the stripping, it does not attack tin. It is especially suitable for high-density boards, such as HDI narrow-pitch advanced boards. Its advantages include: Insoluble film, long life time of the agent, fast stripping speed, easy control of the agent, and good antioxidant function. It is a powerful and multifunctional stripping agent.

This series of developers are designed for the development of dry film and solder masking. During the preparation process, the soda ash is purified. At the same time, its special additives can speed up the development speed, prevent the generation of scale, and extend the life time of the bath up to 3 to 5 times.

BM-088 is a new type of tank rinsing agent specially designed for cleaning the developing tank, stripping tank and etching tank. It is composed of a special non-ionic surfactant, which can quickly remove the dirt in the tank. Regular cleaning can maintain the tank clean, and the yield quality of the production line is improved. And it can quickly and effectively remove the residual film scum (scum) on the slot wall, it can improve the yield of process.

CT-9901 is a kind of micro-etching agent containing sodium persulfate, which can effectively flatten the copper surface after Super-roughening to reduce Ra and increase the RSZ. Containing sodium persulfate stabilizer can reduce the cracking rate of the oxidant and increase the etching rate. The amount of corrosion can reduce the amount of sodium persulfate used, and it can promote the adhesion of the gold-plated surface, and it can also increase the solderability of OSP.

CR-200 stabilizer is an additive specially designed for copper chloride etching solution, mainly to reduce etching side etching (to increase the etching factor after etching). Especially for high-density and fine-pitch working substrates are the main product demands.

This series of products are specially designed to be used in touch panel photoresist stripping agent. Except for effective accelerated stripping, it doesn’t attack the copper surface and is hard to attack aluminum at room temperature. Long life time of the agent, and it’s a powerful multifunctional stripping agent. This series of products are green and environmentally friendly. Stripping at room temperature can reduce carbon and save energy.

This series of developers are designed for the development of dry film and solder masking. During the preparation process, the soda ash is purified. At the same time, its special additives can speed up the development speed, prevent the generation of scale, and extend the life time of the bath up to 3 to 5 times.

CT-113B acid cleaner is a product specially designed for PCB industry and the pre-treatment process of circuit electroplating. It can be combined with a microetching agent to achieve the purpose of removing fingerprints, oxidation and dry film residues, thereby ensuring the quality of the coating.

This series of products are copper corrosion stabilizers for PCB H2SO4/H2O2 systems.

This series of products are specially designed to be used in touch panel photoresist stripping agent. Except for effective accelerated stripping, it doesn’t attack the copper surface and is hard to attack aluminum at room temperature. Long life time of the agent, and it’s a powerful multifunctional stripping agent. This series of products are green and environmentally friendly. Stripping at room temperature can reduce carbon and save energy.

This series of developers are designed for the development of dry film and solder masking. During the preparation process, the soda ash is purified. At the same time, its special additives can speed up the development speed, prevent the generation of scale, and extend the life time of the bath up to 3 to 5 times.

BM-035N screen cleaning agent is a special solvent that is not volatile and has no peculiar smell. It is mainly suitable for solder mask. It has a very good effect with automatic mechanical spraying, and does not damage the screen emulsion. Good effect, strong hydrophobicity, good washing property, and easy to dissolve in water. The current manual screen back-washing can save manpower and improve work cleaning caused by screen breakage, agent loss, increased waste liquid volume, and reduction of the traditional use of MEK, BCS, odor and irritation, and harm to human health... and other problems. It widely praised and used by the PCB industry.

This series of products are copper corrosion stabilizers for PCB H2SO4/H2O2 systems.

TX-100 is a water-soluble formula, which is specially designed for chemical copper, electroplated copper or any other copper surface that needs corrosion resistance. Only a small amount is needed to effectively extend the oxidation time of the metal surface. The plated parts after used are easy to store, the anti-oxidation film can be easily removed by cleaning agent, and the surface of the plated parts can be easily activated.
Antioxidant TX-100 can provide an anti-corrosion organic metal film on the copper surface, so that the copper surface will not be rapidly oxidized before the next production process and affect the quality. Because copper is prone to corrosion and discoloration on the copper surface in humid surrounding, the gloss and contact resistance of copper are deteriorated. This protective film not only provides protection on the copper surface, but also improves the adhesion of subsequent processing procedures.

This series of products are copper corrosion stabilizers for PCB H2SO4/H2O2 systems.

During the development process, the developed dry film and ink easily cause the following three problems:
(1) The body of the developing tank and the roller are dirty.
(2) Sticking problems occur, residues in the hole, resulting in a decline in yield.
(3) The filter element is blocked quickly, and the cleaning cost of the tank increases. This high-performance developing additive is aimed at improving this problem, thereby reducing maintenance frequency, shortening maintenance man-hours, and increasing productivity. It can also reduce the amount of waste water and increase the production yield.

This series of products is a special etching solution for ITO etching process.

PC-582 is a chemical regenerating agent used to oxidize cuprous chloride to copper chloride in copper chloride etching. PC-582 can replace hydrogen peroxide in most copper chloride etchings, and is safer than hydrogen peroxide in design. It can be applied to various copper chloride etching systems.

This series of products is a special etching solution for ITO etching process.

After the laser processing debris generated during laser dicing sticks to the surface of the wafer, it cannot be removed only by pure water cleaning, which will cause poor adhesion or leakage current, which will increase product defects. LC-600 water-soluble protective film, as long as it is coated on the processing surface before laser processing, it can greatly inhibit the adhesion of debris and help improve the reliability of the product.

ALE-880 is a special etching solution for etching aluminum.